Set componente si accesorii electronice pentru INCDMTM Bucuresti 1. 885060 - 1 buc. - 540,00 lei + TVA/buc. Design Kit WCAP-CSGP 0603 72 values, 3600 components Multi-Layer Ceramic Chip Capacitors; 0603; 1 pF - 10 μF; 6.3 V(DC) - 50 V(DC); NP0 / X7R / X5R, eiCap® Approval: RoHS-Compl.2011/65/EU&2015/863 2. 744761 - 1 buc. - 525,00 lei + TVA/buc. Design Kit WE-KI 0603 SMT - 5% Tol 1 size, 36 values, 1080 components, eiSos® A...
Set componente si accesorii electronice pentru INCDMTM Bucuresti 1. 885060 - 1 buc. - 540,00 lei + TVA/buc. Design Kit WCAP-CSGP 0603 72 values, 3600 components Multi-Layer Ceramic Chip Capacitors; 0603; 1 pF - 10 μF; 6.3 V(DC) - 50 V(DC); NP0 / X7R / X5R, eiCap® Approval: RoHS-Compl.2011/65/EU&2015/863 2. 744761 - 1 buc. - 525,00 lei + TVA/buc. Design Kit WE-KI 0603 SMT - 5% Tol 1 size, 36 values, 1080 components, eiSos® Approval: RoHS-Compl.2011/65/EU&2015/863 3. 2536030320091 - 2 buc. - 95,00 lei + TVA/buc. Evaluation Board WSEN-ISDS 6 Axis Inertial Measurement Unit 22.5 x 33.5 mm, I2C & SPI. included: - 1pc EV-Board with sensor 2536030320001 - 2pc pin header 61300711121 tipul ambalajului: Bag, eiSmart® Approval: ESD, : RoHS-Compl.2011/65/EU&2015/863, : REACh–Conf./decl.(EC)1907/2006 4. 2611011024010 - 2 buc. - 55,00 lei + TVA/buc. Proteus-III Bluetooth 5.1 module SPI T&R ID: 0018DA 30 0000 - 3F FFFF RF protocol: Bluetooth & WE-ProWare smart antenna configuration (Contacting of the integrated PCB antenna is possible via module pads) with RF shield, 12x8x2mm tipul ambalajului: 7''Reel, sMSL: 3, eiSmart® Approval: ESD, : RoHS-Compl.2011/65/EU&2015/863, : REACh–Conf./decl.(EC)1907/2006 5. 2611149024011 - 2 buc. - 85,00 lei + TVA/buc. Proteus-III SPI Bluetooth 5.1 Family EV-Board ID: 0018DA 30 0000 - 3F FFFF RF protocol: Bluetooth & WE-ProWare Bluetooth 5.1 ready EV-Board with internal PCB-antenna tipul ambalajului: Bag, eiSmart® Approval: ESD, : RoHS-Compl.2011/65/EU&2015/863